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3 Latest Announced Rounds

  • $34,000,000
    Seed

    1 Investors

    Technology, Information and Internet
    Jul 4th, 2025
  • $5,500,000
    Seed

    1 Investors

    Software Development
    Jul 4th, 2025
  • $28,500,000
    Series A

    2 Investors

    Venture Capital and Private Equity Principals
    Jul 4th, 2025
$840.57M Raised in 47 Funding Rounds in the past 7 Days - View All

Funding Round Profile

VEIR

start up
United States - Woburn, Massachusetts
  • 31/07/2023
  • Series A
  • $24,900,000

VEIR is developing a new generation of High Temperature Superconductor (HTS)-based transmission lines. VEIR’s evaporative cooling architecture delivers 20 times the cooling power per kilogram of coolant flow compared to conventional approaches. VEIR’s innovations will enable reliable, low loss, cost–effective HTS-based transmission over long distances in narrow rights–of–way, connecting the lowest cost renewable power to where it’s needed, when it’s needed.


Related People

Tim HeidelFounder

Tim Heidel United States - Greater Boston

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