Albuquerque, NM, April 21, 2023 -- 3D Glass Solutions, Inc. (3DGS), a leading high-tech manufacturing business focused on the fabrication of electronic systems and devices using photo-definable glass-ceramics, today announced it has raised $30 million in Series C funding. The round was led by Intel Capital and Walden Catalyst Ventures, with participation from Lockheed Martin, Cambium Capital Partners, and Applied Ventures LLC.

This latest funding will be used to support the company's continued growth and expansion, as well as to accelerate the development and commercialization of its patented low-loss photosensitive APEX® Glass technology.

Founded by Babu Mandava, 3DGS has become a leader in glass-based system-in-package (SiP) devices and components, leveraging its unique product solutions to provide device manufacturing and systems integration services for a number of standard and custom products. With its foundational patent positions related to all photo-sensitive glass-ceramic materials and devices, 3DGS owns the fundamental intellectual property (IP) for all four positions (materials, design, systems, & manufacturing) related to glass-ceramic devices for the electronics packaging industry.

"Our mission at 3DGS is to provide our customers with an integrative solution in RF electronics and IC packaging that allows them to integrate more components onto a single platform while decreasing overall manufacturing costs," said Babu Mandava, Founder of 3D Glass Solutions, Inc. "This funding will allow us to continue innovating and developing cutting-edge technologies that will help our customers stay ahead of the curve."